BT IC Surface Mount BES2700YP Ultra-Low Power Dual-Mode BT 5.3 Audio SoC IC
Product Description Of BES2700YP
BES2700YP is the latest generation of ultra-low power, highly integrated BT audio SoC, using 12nm process, into dual-mode BT 5.3, support BT&BLE, the main processor built-in Arm Cortex-M55 CPU and Tensilica HiFi 4 DSP, greatly enhance the chip's computing performance, sensor hub subsystem built-in STAR-MC1 MCU and neural network processor BECO NPU are built into the sensor hub subsystem to achieve rich application processing capability while significantly reducing power consumption.
Specification Of BES2700YP
| Part Number: | BES2700YP | Package: | BGA |
| Type: | BT 5.3 | Process: | 12nm |
Product Images Of BES2700YP
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FAQ
Q: Are your products original?
A: Yes, all products are original, new original import is our purpose.
Q: Which Certificates do you have?
A: We are ISO 9001:2015 Certified Company and member of ERAI.
Q: Can you support small quantity order or sample?Is the sample free?
A: Yes,we support sample order and small order.Sample cost is different according to your order or project.
Q: How to ship my order? Is it safe?
A: We use express to ship,such as DHL,Fedex,UPS,TNT,EMS.We can also use your suggested forwarder.Products will be in good packing and ensure the safety and we are responsible to product damage to your order.
Q: What about the lead time?
A: We can ship stock parts within 5 working days.If without stock,we will confirm lead time for you based on your order quantity.
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BT IC Surface Mount BES2700YP Ultra-Low Power Dual-Mode BT 5.3 Audio SoC IC Images
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